Thermal Paste
#1
Posted 29 July 2012 - 02:20 AM
#2
Posted 29 July 2012 - 05:11 AM
They're probably using parts that don't heat up very much, and are placing in good fans for the ones that do.
The post above was certified to be simply smashing by the Wii U Forum Staff.
http://www.ebay.com/...mecollector1982
#3
Posted 29 July 2012 - 05:17 AM
This is probably the...second or third to weirdest thread I've ever seen on this forum. But I haven't been around forever, so what do I know?
They're probably using parts that don't heat up very much, and are placing in good fans for the ones that do.
No offense but do you know what thermal paste is?
#4
Posted 29 July 2012 - 05:22 AM
No offense but do you know what thermal paste is?
If I were to wager a guess, thermal paste is a paste suited for high temperatures to keep certain parts of the console from melting.
The post above was certified to be simply smashing by the Wii U Forum Staff.
http://www.ebay.com/...mecollector1982
#5
Posted 29 July 2012 - 05:27 AM
#6
Posted 29 July 2012 - 05:38 AM
#7
Posted 29 July 2012 - 06:06 AM
If I were to wager a guess, thermal paste is a paste suited for high temperatures to keep certain parts of the console from melting.
It's a paste that increases the heat conductivity between two materials.
So what it does is conducting the heat from the processor to the processor fan.
#8
Posted 29 July 2012 - 06:07 AM
#9
Posted 29 July 2012 - 06:53 AM
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#10
Posted 29 July 2012 - 08:31 AM
Once a fan is stuck into a console it's pretty much not going anywhere.
cheap. Never makes a difference imo anyway.
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#11
Posted 29 July 2012 - 02:25 PM
It could potentially make a difference; I've had a laptop with really bad thermal paste, and it had some severe overheating issues. I had to go and buy some better paste in order for the computer to even be functional. It would be more problematic for a Nintendo console if it happens, as one does not simply open it up and mess with the components.
But I really don't think this is going to be an issue.
#12
Posted 29 July 2012 - 02:45 PM
#13
Posted 29 July 2012 - 03:19 PM
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#14
Posted 29 July 2012 - 04:19 PM
The 360 and ps3 over heated faster because sony and microsoft used lead free solder for the gpu and cpu chips.Without lead in the solder for these chips they were prone to over heat more quickly.I'm guessing nintendo used solder that had lead in it which is why the failure rate was so much lower.I don't think (well i hope) that sony any microsoft will make that horrible mistake again.
Thats kind of a mix up of information.
Lead/tin has a lower melting point of 183 degrees celsius, whereas lead free solders have a melting point above 220 degrees, so lead tin solder would catastrophically fail before lead free solder, meaning its more prone to failure at lower temperatures.
So, yes, lead/tin soldered processors DO run cooler than lead free, but not because the lead has something to do with dissipating heat, but the processor would fail otherwise.
Lead free solder actually improves dramatically current carrying capabilities, and heat resiliancy.
While there IS a negative tradeoff, its not on the performance end, but the production end. The increased melting point means the convection ovens must be ran hotter, thus drawing more power and thus money, more stress is put on the flip chip during production, as well as other processor components that may have to be replaced to withstand the new higher temp production process.
Bit even lead free solder with its higher melting point will faill if said melting point is breached.
And crappy heat sinks and burnt up thermal paste are just some of the things the 360 had to get that job done.
#15
Posted 30 July 2012 - 04:37 AM
#16
Posted 30 July 2012 - 08:22 AM
#17
Posted 30 July 2012 - 10:07 AM
Don't think this is a concern. Nintendo make robust hardware. Its quite possible the themal paste will be generic low cost paste that is used in most manufacturing of such devices. Nintendo will be costing the wii u quite low so don't expect a fancy fan and heatink using super expensive thermal paste. They will design a low cost robust console with as much performance as they can achieve for that low price. Clearly the small form factor is an issue. I'm still hoping for a 32nm fabrication process so a bit more performance can be achieved.
Nintendo tends to use pretty good heatsinks.... Their choice in fans are a little dinky though, But the heatsinks have been cartoonishly large, thick based and thick finned.
Something to consider about the wii u's form factor is that it has an external brick and no internal hard drive.
#18
Posted 31 July 2012 - 04:56 AM
http://en.wikipedia.org/wiki/Foxconn
There is no mystery where the wii u will be made.
#19
Posted 31 July 2012 - 05:59 AM
I think... it'll be ok.
It could potentially make a difference; I've had a laptop with really bad thermal paste, and it had some severe overheating issues. I had to go and buy some better paste in order for the computer to even be functional. It would be more problematic for a Nintendo console if it happens, as one does not simply open it up and mess with the components.
But I really don't think this is going to be an issue.
It's not important.
Once a fan is stuck into a console it's pretty much not going anywhere.
cheap. Never makes a difference imo anyway.
The paste isn't for attaching.
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